%0 Journal Article
%T Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications
%A Windlass, H.
%A Raj, P.M.
%A Balaraman, D.
%A Bhattacharya, S.K.
%A Tummala, R.R.
%A ,
%J IEEE Transactions on Advanced Packaging
%V 26
%N 1
%P 10-16
%@ 1521-3323
%D 2003-02-01
%I Institute of Electrical and Electronics Engineers (IEEE)
%~ DeepDyve