%0 Journal Article
%T Integrated hygro-swelling and thermo-mechanical behavior of mold compound for MEMS package during reflow after moisture preconditioning
%A Kwak, Jae B.
%A Park, Seungbae
%J Microelectronics International
%V 32
%N 1
%P 8-17
%@ 1356-5362
%D 2015-01-05
%I Emerald Group Publishing Limited
%~ DeepDyve