%0 Journal Article
%T Polyimide-Damage-Free, CMOS-Compatible Removal of Polymer Residues from Deep Reactive Ion Etching Passivation
%A Wu, W.J.
%A Zhu, T.
%A Liu, J.Q.
%A Fan, J.
%A Tu, L.C.
%J Journal of Electronic Materials
%V 44
%N 3
%P 991-998
%@ 0361-5235
%D 2015-01-08
%I Springer US
%~ DeepDyve