%0 Journal Article
%T A novel copper electroplating formula for laser‐drilled micro via and through hole filling
%A Dow, Wei‐Ping
%A Chen, Hsiang‐Hao
%J Circuit World
%V 30
%N 3
%P 33-36
%@ 0305-6120
%D 2004-09-01
%I Emerald Group Publishing Limited
%~ DeepDyve