%0 Journal Article
%T Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties
%A Anderson, I.
%A Cook, B.
%A Harringa, J.
%A Terpstra, R.
%J JOM
%V 54
%N 6
%P 26-29
%@ 1047-4838
%D 2007-09-07
%I Springer-Verlag
%~ DeepDyve