TY - JOUR
AU - Zhou, David D.
AB - [Many implantable medical devices contain sophisticated electronic circuits. Hermetic packaging is required to provide the implant’s electronic circuitry with protection from the harsh environment of the human body. This chapter provides a review of available hermetic sealing methods and their applications. General considerations of implantable medical device packaging are discussed. Various testing methods applicable to the packaging of implantable medical devices are also presented. Many issues associated with hermetic packaging are not yet completely understood, nor are any corresponding difficulties completely overcome. The continued miniaturization of future implantable medical devices provides both opportunities and challenges for packaging/materials engineers to improve the existing packaging methods, and to develop new methods. Reliable hermetic micropackaging technologies are the key to a wide utilization of microelectromechanical systems (MEMS) in miniaturized implantable medical devices.]
TI - Implantable Neural Prostheses 2: Technology Advances and Challenges in Hermetic Packaging for Implantable Medical Devices
DA - 2009-09-05
UR - https://www.deepdyve.com/lp/springer-journals/implantable-neural-prostheses-2-technology-advances-and-challenges-in-B0n9sECEWG
DP - DeepDyve
ER -