TY - JOUR
AU1 - Xi, Rui
AU2 - Yu, Jiangyou
AU3 - Cao, Le
AU4 - Zheng, Xiaojiang
AU5 - Guo, Jun
AB - Most solder paste printers are configured to periodically clean the stencil to maintain printing quality. However, a periodical cleaning control may result in excessive cleaning operations. The purpose of this paper is to develop a control method to schedule stencil cleaning operations appropriately.Design/methodology/approachA hybrid failure rate model of the stencil printing process with age reduction factor and failure rate increase factor is presented. A stencil cleaning policy based on system reliability is introduced. An optimization model used to derive the optimal stencil cleaning schedule is provided.FindingsAn aperiodic stencil cleaning control with good adaptability is achieved. A comparative analysis indicates that aperiodic control has better printing system reliability than traditional periodical control under the same cleaning resource consumption.Originality/valuePeriodical cleaning control commonly used in industrial printing process often results in excessive cleaning operations. By incorporating the printing system reliability, this paper develops an aperiodic stencil cleaning control method based on hybrid failure rate model of the stencil printing process. It helps to reduce unnecessary cleaning operations while keeping printing quality stable.
TI - Cleaning control of stencil printing subject to performance deterioration
JF - Soldering & Surface Mount Technology
DO - 10.1108/ssmt-12-2019-0043
DA - 2021-05-17
UR - https://www.deepdyve.com/lp/emerald-publishing/cleaning-control-of-stencil-printing-subject-to-performance-jrq1jdGCXQ
SP - 151
EP - 158
VL - 33
IS - 3
DP - DeepDyve
ER -