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- Publisher
- Springer Journals
- Copyright
- Copyright © Springer 2002
- ISSN
- 1598-9623
- DOI
- 10.1007/bf03027007
- Publisher site
- See Article on Publisher Site
Abstract
An expression including the effect of residual stress on the interfacial energy release rate is proposed for peeling experiments according to the energy-balance argument. The influence of residual stress on the external work is also contained in the expression. Two numerical methods are employed to evaluate the values of the work expenditureGdb, which is the actual energy dissipated during bending of the peel arm near the peel front. The peeling method is employed to test the interfacial energy release rates,G, for Ni films on Titanium and stainless steel substrates. The results indicate that the value ofG for Ni films on stainless steel substrate is about 5.47–6.03 N/m, while 5.23–6.71 N/m for Ni films on titanium substrate; the interfacial energy release rates,G, do not depend on the residual stress in film, film thickness nor peel angle. The effect of residual stress in film on peel strengthP/h is also discussed.
Journal
Metals and Materials – Springer Journals
Published: Apr 1, 2002
Keywords: peel test; interfacial energy release rate; peel strength; film thickness; residual stress; peel angle