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A Chemical Etchant for the Selective Removal of GaAs Through SiO2 Masks

A Chemical Etchant for the Selective Removal of GaAs Through SiO2 Masks An etchant has been developed for etching selected regions of through windows in an mask. This etchant has been found to provide fiat etching profiles across the unmasked regions of the GaAs, and has considerably reduced undercutting commonly caused by attack of the . The chemical etching rates have been evaluated and have been found to depend strongly on the concentration of the etching solution and on the crystal orientation of the . The utility of the for device preparation has been demonstrated by its application to the fabrication of interdigitated bipolar transistors with 5 μm base‐emitter separation. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of the Electrochemical Society IOP Publishing

A Chemical Etchant for the Selective Removal of GaAs Through SiO2 Masks

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Copyright
Copyright © 1974 ECS - The Electrochemical Society
ISSN
0013-4651
eISSN
1945-7111
DOI
10.1149/1.2402016
Publisher site
See Article on Publisher Site

Abstract

An etchant has been developed for etching selected regions of through windows in an mask. This etchant has been found to provide fiat etching profiles across the unmasked regions of the GaAs, and has considerably reduced undercutting commonly caused by attack of the . The chemical etching rates have been evaluated and have been found to depend strongly on the concentration of the etching solution and on the crystal orientation of the . The utility of the for device preparation has been demonstrated by its application to the fabrication of interdigitated bipolar transistors with 5 μm base‐emitter separation.

Journal

Journal of the Electrochemical SocietyIOP Publishing

Published: Sep 1, 1974

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