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Performance of AlGaInP LEDs on silicon substrates through low threading dislocation density (TDD) germanium buffer layer

Performance of AlGaInP LEDs on silicon substrates through low threading dislocation density (TDD)... Performance of GaInP/AlGaInP multi-quantum wells light-emitting diodes (LEDs) grown on low threading dislocation density (TDD) Germanium-on-Silicon (Ge/Si) substrates are compared and studied. Three approaches are used to realize the low TDD Ge/Si substrates. The first approach is the two-step growth of Ge/Si substrate with TDD of ∼5 × 107 cm−2. The second approach is through doped the Ge seed layer with arsenic (As) and TDD of <5 × 106 cm−2 can be achieved. The third approach is through wafer bonding and layer transfer techniques, germanium-on-insulator (GOI) substrate with TDD of ∼1.2 × 106 cm−2 can be fabricated. To demonstrate the quality of these Ge/Si substrates, LEDs fabricated on commercially available Ge/Si and bulk Ge substrates were also included for comparison purposes. The LEDs fabricated on the As-doped Ge/Si and GOI substrates exhibit superior performances, with output light intensity at least 2× higher compared to devices fabricated on commercially available Ge/Si substrate. These findings enable the monolithic integration of visible-band optical sources with Si-based control circuitry. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Semiconductor Science and Technology IOP Publishing

Performance of AlGaInP LEDs on silicon substrates through low threading dislocation density (TDD) germanium buffer layer

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References (17)

Copyright
Copyright © 2018 IOP Publishing Ltd
ISSN
0268-1242
eISSN
1361-6641
DOI
10.1088/1361-6641/aadc27
Publisher site
See Article on Publisher Site

Abstract

Performance of GaInP/AlGaInP multi-quantum wells light-emitting diodes (LEDs) grown on low threading dislocation density (TDD) Germanium-on-Silicon (Ge/Si) substrates are compared and studied. Three approaches are used to realize the low TDD Ge/Si substrates. The first approach is the two-step growth of Ge/Si substrate with TDD of ∼5 × 107 cm−2. The second approach is through doped the Ge seed layer with arsenic (As) and TDD of <5 × 106 cm−2 can be achieved. The third approach is through wafer bonding and layer transfer techniques, germanium-on-insulator (GOI) substrate with TDD of ∼1.2 × 106 cm−2 can be fabricated. To demonstrate the quality of these Ge/Si substrates, LEDs fabricated on commercially available Ge/Si and bulk Ge substrates were also included for comparison purposes. The LEDs fabricated on the As-doped Ge/Si and GOI substrates exhibit superior performances, with output light intensity at least 2× higher compared to devices fabricated on commercially available Ge/Si substrate. These findings enable the monolithic integration of visible-band optical sources with Si-based control circuitry.

Journal

Semiconductor Science and TechnologyIOP Publishing

Published: Oct 1, 2018

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